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Published: 2025-01-28 22:37:18.425250 Category: Technology Type: Illustration Model release: No
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Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process.

Contributor: ImageKing
ID : 1225946383
TitleFilesize
Illustration8736x4896


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Keywords
chips, machine, production, industry, wafer, semiconductor, microchip, factory, technology, foundry, integrated, line, photolithography, manufacturing, electronic, shortage, nanotechnology, silicon, research, package, computer, arm, cardboard box, facility, disc, circuit, science, substrate, process, lithography, die, industrial, transistor, device, controller, equipment, processor, memory, central processing unit, development, component, fabrication, constructed


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